| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer separation method, by which separated wafers can be held with a specified gap, when a wafer wherein a plurality of designed dividing lines are formed like a grid on its surface and functional elements are formed in multiple areas divided by the designed dividing lines are separated into chips along the dividing lines planned. SOLUTION: A laser light with permeability is applied to designed dividing lines of a wafer 10, and after a deteriorated layer has been formed, a holding tape 3 adhered with the wafer 10 is extended, and the wafer 10 is divided into chips 100 along the designed dividing lines where the deteriorated layer is formed, and a gap S is between the chips. In this state, external stimulation is applied to an area where the wafer 10 is adhered to the holding tape 3, thus curing the adhesive layer of the holding tape so as to keep a gap among the chips. COPYRIGHT: (C)2006,JPO&NCIPI |
