发明名称 ELECTRIC COMPONENT MODULE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electric component module which can be easily manufactured using an ordinary circuit board, can sufficiently cool an electric component with use of a Peltier element, and can realize its miniaturization. SOLUTION: The electric component module comprises an ordinary circuit board 1 being widely used, a Peltier element 2 accommodated within a hole 1a provided in the circuit board 1, an electric component 3 located on a first substrate 2a of the Peltier element 2 with a thermally-conductive sheet 5 disposed therebetween, and a metal-made heat radiating plate 4 fixed on the rear surface of the circuit board 1 with an insulating layer 6 disposed therebetween and provided on a heat radiating side substrate 2b of the Peltier element 2 with the thermally-conductive sheet 5 disposed therebetween. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006054318(A) 申请公布日期 2006.02.23
申请号 JP20040234815 申请日期 2004.08.11
申请人 SEIKO INSTRUMENTS INC 发明人 NITORI KOJI;SUDO SHUZO;SUZUKI MAKOTO;FUJITAKE SHINICHI;YAMAMOTO KOSUKE;KISHI MATSUO
分类号 H01L23/38;H01L35/30;H05K7/20 主分类号 H01L23/38
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