| 摘要 |
A stencil printer for printing solder paste onto a substrate includes a frame, a stencil, coupled to the frame, having apertures formed therein, a support assembly, coupled to the frame, to support the substrate in a printing position beneath the stencil, and a dispensing head (28) coupled to the frame in such a manner that the dispensing head is configured to traverse the stencil during first and second print strokes. The dispensing head includes a frame assembly and a wiper blade assembly (64), coupled to the frame assembly, having first and second wiper blades (66, 68) that contact the stencil to print solder paste onto the stencil during a print stroke. The first and second wiper blades (66, 68) are constructed and arranged to force solder paste through the apertures of the stencil. The dispensing head (28) further includes a dispensing unit (50), coupled to the frame assembly, having a chamber adapted to dispense solder paste, the dispensing unit (50) being disposed between the first and second wiper blades (66, 68) to deposit solder paste therebetween. A method for printing solder paste on a substrate is further disclosed. |
