SLIT COAT-TYPE APPLICATION METHOD AND ELECTRONIC DEVICE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a slit coat-type application method which enables the even application of a coating solution onto the surface of a substrate having a predetermined shape of recess and preventing the drying mark and shrink mark of the coating solution and a preferable electronic device substrate used for the slit coat-type application method. SOLUTION: When the coating solution 404 is applied onto the substrate 130 by horizontally and relatively moving a retaining table 402 fixing the substrate 130 having the recess 32 which is a slot having a pentagonal or more polygonal opening shape and where the angle of each corner on at least one end side in the longitudinal direction is an obtuse angle and a coating head 403 which is disposed so as to be opposed to the surface of the substrate 130 retained at the table 402 and has a slit-like nozzle opening 406 spraying a predetermined coating solution onto the surface of the substrate 130, the solution 404 is designed to be applied onto the surface of the substrate 130 while the head 403 is being relatively moved from the other end side to one end side of the recess 32 formed on the substrate 130. COPYRIGHT: (C)2006,JPO&NCIPI