MODULAR CONTACTOR SYSTEM FOR TESTING PACKAGED SEMICONDUCTOR DEVICES

摘要

An interconnect mechanism for providing electrical interconnection between a device under test and a tester includes a base (102) having a first side and a second side. The base defines a plurality of apertures extending from the first side to the second side. The first side of the base is configured to receive the device under test. The interconnect mechanism also includes a plurality of alignment mechanisms (104a, 104b) configured to be detachably coupled to the first side of the base. The plurality of alignment mechanisms define an area (105) of the first side of the base to receive the device under test when the plurality of alignment mechanisms are coupled to the first side of the base. Each of the plurality of alignment mechanisms includes an adjustment mechanism (106a, 106b) for adjusting the area of the first side of the base defined by the plurality of alignment mechanisms.