| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum chuck jig, a vacuum chuck method using this vacuum chuck jig, and a manufacturing method of a liquid-droplet discharging head that uses this vacuum chuck jig and having a high etching accuracy, wherein flaws and defects are hardly generated by this vacuum chuck jig in the processed portion of a sucked substrate made of silicon, etc. SOLUTION: First suction holes 3 for sucking a sucked substrate are provided in the outer peripheral portion than the central portion occupying a certain range, separated from the center of a surface of the vacuum chucking jig which is present on the side of sucking the sucked substrate. Also, in addition to the first suction holes 3 provided in the outer peripheral portion, a second suction hole 3 for sucking the sucked substrate is provided to the center of the surface, which is installed on the side of sucking the sucked substrate. Further, suction portions 2, having the formed first suction hole 3 or holes 3, are so provided protrusively from the surface as to be able to hold the sucked substrate by only the suction portions 2. COPYRIGHT: (C)2006,JPO&NCIPI |
