| 摘要 |
A method for fabricating microplasma discharge devices and arrays. The method employs techniques drawn from semiconductor device fabrication, such as chemical processing and photolithography, to produce arrays of devices inexpensively. An interdigitated electrode array is deposited on a first substrate. Cavities are formed in a second substrate by laser micromachining, etching, or by chemical (wet or dry) etching and the second substrate is overlaid on the electrode array. The inter-electrode spacing and electrode width are set so that each cavity has at least one pair of electrodes underneath it to excite a microplasma discharge in the cavity. The need to precisely register the two substrates is thus avoided.
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