发明名称 WIRING BOARD, MANUFACTURING METHOD THEREFOR, DISPLAY DEVICE AND ELECTRONIC UNIT
摘要 <p>PROBLEM TO BE SOLVED: To lighten a wiring board. SOLUTION: The wiring board 1 has a mounting area 14 where an integrated circuit provided with a plurality of electrodes is mounted and a plurality of base material side wirings 12 which are to be connected to the integrated circuit are formed. Conductor patterns 13 having shapes that radially extend from a prescribed point in the mounting area 14 and reach two or above grounded base material side wirings 12 are formed.</p>
申请公布号 JP2002164629(A) 申请公布日期 2002.06.07
申请号 JP20010212083 申请日期 2001.07.12
申请人 SEIKO EPSON CORP 发明人 KATO HIROKI
分类号 G02F1/1345;G09F9/00;H01L23/12;H05K1/02;H05K1/03;H05K1/14;H05K3/32;H05K3/34;(IPC1-7):H05K1/02;G02F1/134 主分类号 G02F1/1345
代理机构 代理人
主权项
地址