| 摘要 |
PROBLEM TO BE SOLVED: To reduce adhesive force with an adhesive sheet for separating merely a semiconductor chip to be picked up, and to pick up even a thin semiconductor chip, without damaging it. SOLUTION: In a device for picking up the semiconductor chip 1 put onto the adhesive sheet 2 for conveying to the next process, an uneven surface is formed only in a rectangular region, having nearly the same size as that of the semiconductor chip in a suction stage 3b. A suction unit 3 comprises the suction stage 3b, where the uneven surface is formed, and a suction cylinder 3a. The suction stage 3b can be replaced, according to the shape conditions of the semiconductor chip to be picked up. The suction stage 3b comprises a porous material 3c or has a through-hole. A heating means is preferably provided at the suction cylinder 3c. |
