| 摘要 |
PROBLEM TO BE SOLVED: To provide a three-dimensional(3D) observation method for multilayer printed circuit board, with which the inside of a multilayer printed circuit board designed on the basis of garber data and drill data can be three-dimensionally observed in free directions, and to provide a recording medium therefor. SOLUTION: Data are read (S1), the presence/absence of a spot mixed with negative data is checked (S2) and when there is a subtraction spot, 3D display processing only of positive data is performed (S3a) but when there is no subtraction spot, 3D display processing is performed as it is (S3b). An operator designates an observation spot with a mouse and when an angle is instructed, the observation spot is displayed at the designated angle (S6 and S7). In internal zoom observation, the change of angle and the change of zoom magnification power are performed (S8 and S9). Therefore, since thickness can be added to the cross section of an aperture or the like, there is no sense of incompatibility in view and the observation is facilitated. |
