| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device in which effect of thermal expansion or heat shrinkage is eliminated even when heating is carried out while employing glass as sealant. <P>SOLUTION: An LED element 1 is mounted on a submount 3 which is then mounted at the distal end of the leads 4A and 4B of a lead frame. The distal end, the LED element 1, and the submount 3 are sealed with a sealing member 5 of a glass material into a predetermined shape. A low melting point glass material having a thermal expansion coefficient approximate to that of the leads 4A and 4B is employed in the sealing member 5. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
