发明名称 Heat-dissipating device with heat pipe
摘要 A heat-dissipating device with heat pipe includes a base having a plurality of pipe spaces therein; a plurality of heat pipes vertically mounted on the base and connected to the pipe spaces respectively; a working fluid filled in the pipe spaces; and a plurality of heat-dissipating fins attached to the plurality of heat pipes and spaced from each other by a predetermined distance. This heat-dissipating device can achieve heat dissipation without bending the heat pipes.
申请公布号 US2006037738(A1) 申请公布日期 2006.02.23
申请号 US20040023500 申请日期 2004.12.29
申请人 INVENTEC CORPORATION 发明人 LI CHIN-YUAN;LIN MAO-CHING
分类号 H05K7/20;G06F1/20;H01L23/427 主分类号 H05K7/20
代理机构 代理人
主权项
地址