发明名称 |
Heat-dissipating device with heat pipe |
摘要 |
A heat-dissipating device with heat pipe includes a base having a plurality of pipe spaces therein; a plurality of heat pipes vertically mounted on the base and connected to the pipe spaces respectively; a working fluid filled in the pipe spaces; and a plurality of heat-dissipating fins attached to the plurality of heat pipes and spaced from each other by a predetermined distance. This heat-dissipating device can achieve heat dissipation without bending the heat pipes.
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申请公布号 |
US2006037738(A1) |
申请公布日期 |
2006.02.23 |
申请号 |
US20040023500 |
申请日期 |
2004.12.29 |
申请人 |
INVENTEC CORPORATION |
发明人 |
LI CHIN-YUAN;LIN MAO-CHING |
分类号 |
H05K7/20;G06F1/20;H01L23/427 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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