发明名称 |
LIQUID METAL THERMAL INTERFACE FOR AN INTEGRATED CIRCUIT DEVICE |
摘要 |
A liquid metal thermal interface for an integrated circuit die. The liquid metal thermal interface may be disposed between the die and another heat transfer element, such as a heat spreader or heat sink. The liquid metal thermal interface includes a liquid metal in fluid communication with a surface of the die, and liquid metal moving over the die surface transfers heat from the die to the heat transfer element. A surface of the heat transfer element may also be in fluid communication with the liquid metal. Other embodiments are described and claimed. |
申请公布号 |
WO2006020332(A1) |
申请公布日期 |
2006.02.23 |
申请号 |
WO2005US25815 |
申请日期 |
2005.07.20 |
申请人 |
INTEL CORPORATION;SAUCIUC, IOAN;CHRYSLER, GREGORY |
发明人 |
SAUCIUC, IOAN;CHRYSLER, GREGORY |
分类号 |
(IPC1-7):H01L23/373;H01L23/42;H01L23/473 |
主分类号 |
(IPC1-7):H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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