| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold assembly for molding a resin seal board capable of preventing the occurrence of the flash of a resin on the side of the solder surface of a land for mounting a post-attaching part. SOLUTION: The mold assembly is constituted of the protruded parts 2c and 3c, which are respectively provided to the upper mold 2 and lower mold 3 of a mold main body 1 for molding an insulating resin layer 5 for sealing the electronic parts mounted on a circuit pattern board 4 and hold the land 4a for mounting the post-attaching electronic parts of the circuit pattern board 4 from the front and back surfaces thereof at the time of molding of the insulating resin layer 5 to form tapered recessed parts 5a and 5b to the insulating resin layer 5, and a flash preventing means 6 provided to the outer peripheral surface of the protruded part 2c of the protruded parts 2c and 3c and suppressing the deformation of the circuit pattern board 4 to prevent the occurrence of the flash on the back of the land 4a. Since no flash is formed on the solder surface of the land 4a on which the post-attaching electronic parts are mounted, no soldering failure occurs when the post-attaching electronic parts are soldered to the land by flowing solder. COPYRIGHT: (C)2006,JPO&NCIPI |
