摘要 |
A method of fabricating a thin film resistor ( 100 ) without a hardmask or resistor head. The resistor material ( 104 ), e.g., NiCr, is deposited. The resistor material ( 104 ) is patterned and sputter etched to form the resistor body without first depositing a hardmask material. For example, a sputter etch chemistry comprising BCl<SUB>3</SUB>, Cl<SUB>2</SUB>, and Ar may be used to etch the resistor material.
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