发明名称 |
Method of lithographic production of structures in a radiation sensitive layer especially for semiconductor devices such as DRAM chips uses radiation absorbing layer |
摘要 |
<p>A method of lithographic production of structures in a radiation-sensitive layer, especially for semiconductor elements, comprises forming a radiation-absorbing layer (1) on or in the substrate (10) and radiating at an angle to the normal so that at least part of the structure in the sensitive layer (20) is shadowed. An independent claim is also included for a structured semiconductor substrate for the above method.</p> |
申请公布号 |
DE102004041679(A1) |
申请公布日期 |
2006.02.23 |
申请号 |
DE20041041679 |
申请日期 |
2004.08.20 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
NUETZEL, JOACHIM;MUEMMLER, KLAUS;THIES, ANDREAS;KAMM, FRANK-MICHAEL |
分类号 |
G03F7/00;G03F7/09;H01L21/308;H01L21/8242 |
主分类号 |
G03F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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