发明名称 Method of lithographic production of structures in a radiation sensitive layer especially for semiconductor devices such as DRAM chips uses radiation absorbing layer
摘要 <p>A method of lithographic production of structures in a radiation-sensitive layer, especially for semiconductor elements, comprises forming a radiation-absorbing layer (1) on or in the substrate (10) and radiating at an angle to the normal so that at least part of the structure in the sensitive layer (20) is shadowed. An independent claim is also included for a structured semiconductor substrate for the above method.</p>
申请公布号 DE102004041679(A1) 申请公布日期 2006.02.23
申请号 DE20041041679 申请日期 2004.08.20
申请人 INFINEON TECHNOLOGIES AG 发明人 NUETZEL, JOACHIM;MUEMMLER, KLAUS;THIES, ANDREAS;KAMM, FRANK-MICHAEL
分类号 G03F7/00;G03F7/09;H01L21/308;H01L21/8242 主分类号 G03F7/00
代理机构 代理人
主权项
地址