| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper foil which hardly causes voids even after having been subjected to fusing treatment with a tin-plated layer coated thereon, and is properly etched. SOLUTION: The copper foil includes less than 30 ppm Cl in an untreated state. The method for manufacturing the copper foil includes electrolysis by using an electrolytic solution that is an aqueous solution of sulfuric acid and copper sulfate, in which Cl<SP>-</SP>ion concentration is controlled to 2.0 mg/l or less and protein concentration is controlled to 0.5 mg/l or less. The copper foil has a composition containing less than 30 ppm Cl in the untreated state; and has such crystal grains on at least the surface to be tin-plated out of both surfaces of the untreated copper foil, as to have a relative intensity ratio I (200)/I (111) of 0.20 or less, which is a value determined by dividing the I (200) by the I (111), when the I (200) indicates a relative peak intensity of a diffraction line on a face (200) among the diffraction lines obtained through X-ray diffraction analysis on the surface, and the I (111) indicates the relative peak intensity of the diffraction line on a face (111). COPYRIGHT: (C)2006,JPO&NCIPI
|
