| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor sealing epoxy resin composition having good fluidity and curability, when a seal is formed, and having good soldering resistance, that is prevented from a crack appearance, even when subjected to soldering treatment at a high temperature corresponding to lead-free soldering. SOLUTION: This semiconductor sealing epoxy resin composition contains (A) an epoxy resin, (B) a phenol resin, (C) an inorganic filling material, (D) an adduct of a phosphine compound with a quinone compound, (E) a compound in which two or more carbon atoms forming an aromatic ring and adjacent to one another each have a hydroxy group combined therewith, and (F) a silane coupling agent as essential components. A semiconductor device is given by sealing a semiconductor element with the composition. COPYRIGHT: (C)2006,JPO&NCIPI
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