发明名称 Heat-sinking base plate and its manufacturing method
摘要 A heat-sinking base plate and its manufacturing method, there are a plastic non-metallic substrate and a heat conductive layer; the substrate has thereon a plurality of micro holes, the heat conductive layer contains a layer of metallic heat conductive coating, the heat conductive layer is applied on the outer surface of the substrate and is filled in the micro holes of the substrate, thereby the substrate is heat conductive, so heat energy can be transferred from one side to the other side of the substrate through the heat conductive layer in the micro holes, and the substrate has an excellent heat-sinking effect.
申请公布号 US2006039116(A1) 申请公布日期 2006.02.23
申请号 US20040909372 申请日期 2004.08.03
申请人 EGBON ELECTRONICS LTD. 发明人 CHEN WAN-TIEN
分类号 H05K7/20 主分类号 H05K7/20
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