| 发明名称 |
COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS |
| 摘要 |
Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a carrier (the lead-free connectors electrically connect the device to the carrier), and fills the gaps between the carrier and the device with an insulating underfill. |
| 申请公布号 |
US2006040567(A1) |
申请公布日期 |
2006.02.23 |
| 申请号 |
US20040711076 |
申请日期 |
2004.08.20 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BERNIER WILLIAM E.;CHENG TIEN-JEN;COLE MARIE S.;EICHSTADT DAVID E.;FAROOQ MUKTA G.;FITZSIMMONS JOHN A.;GOLDMANN LEWIS S.;KNICKERBOCKER JOHN U.;LOPEZ TASHA E.;WELSH DAVID J. |
| 分类号 |
H05K1/00;H01R12/00;H01R13/42 |
主分类号 |
H05K1/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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