| 摘要 |
Methods and apparatus for removing material from a substrate, such as an IC component, are disclosed. The methods include creating a plasma in an evacuatable chamber, by providing a power source to an electrode in the chamber, and contacting the substrate surface with at least one of ions, atoms and free radicals of the plasma. The power source, preferably DC, is supplied to the electrode as a variable, and preferably a pulsed voltage to prevent arcing.
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