| 摘要 |
A pattern is formed with an insulative resin on a bonding face of a silicon chip, which is a heat generating element, and a pattern is formed with the insulative resin on a bonding face of a heat sink, which is a heat dissipating element, in alignment with the insulative resin parts formed on the silicon chip. The silicon chip and the heat sink are bonded to each other via a heat transfer sheet. The silicon chip and the heat sink are bonded to each other by a metal to form metal connection portions in a region where no insulative resin parts are formed, while the silicon ship and the heat sink are bonded to each other by a resin to form resin connection portions in a region where the insulative resin parts are formed. |
