发明名称 CIRCUIT CONNECTING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a circuit connecting material for electricity/electron which is excellent in heat resistance, moisture resistance, and workability, and in which severe reliability is demanded especially. SOLUTION: This circuit connecting material is composed of an adhesive composition which contains (1) phenoxy resin, (2) naphthalene based epoxy resin, and (3) a latent curing agent as indispensable components, and conductive particles. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006054180(A) 申请公布日期 2006.02.23
申请号 JP20050225995 申请日期 2005.08.03
申请人 HITACHI CHEM CO LTD 发明人 YANAGAWA TOSHIYUKI;FUJINAWA MITSUGI;OTA TOMOHISA
分类号 H01B1/22;H01R11/01 主分类号 H01B1/22
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