| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate design support device, method and program, capable of easily predicting a displacement by temperature change even in a printed wiring board having a complicated shape or structure at a low cost. SOLUTION: This substrate design support device for simplifying a designed printed wiring board to predict the displacement of the printed wiring board comprises a layer thickness operation part 21 determining, for each layer constituting the printed wiring board, an average thickness to a substrate area according to a predetermined rule for an essential material constituting the layer concerned; and a lamination model formation part 22 laminating layers of the layer thicknesses computed by the layer thickness operation part 21 to form a simple lamination model. COPYRIGHT: (C)2006,JPO&NCIPI
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