TWO-DIMENSIONAL ULTRASOUND TRANSDUCER ARRAYS

摘要

An ultrasound transducer (100) comprises an integrated circuit (52) and an array of acoustic elements (92,94,96) coupled to the integrated circuit via flip chip bumps (76,78). The flip chip bumps comprise high aspect ratio bumps having an aspect ratio greater than 1:1. The aspect ratio comprises a ratio of a bump height (82) to a bump width (84).