发明名称 ELECTROLESS GOLD PLATING LIQUID
摘要 Disclosed is an electroless gold plating liquid with excellent stability which has a practically sufficient deposition rate without containing heavy metal ions such as thallium ions. Specifically disclosed is an electroless gold plating liquid characterized by containing a noncyanic gold salt as a gold salt, an alkali metal salt or ammonium salt of sulfurous acid and thiosulfuric acid as a complexing agent for gold, a hydroxyalkyl sulfonic acid represented by the general formula below or a salt thereof as a reducing agent, and an amine compound. Formula (In the above formula, R represents a hydrogen, a carboxy group, an optionally substituted phenyl group, a tolyl group, a naphthyl group, a saturated or unsaturated alkyl group, an acetyl group, an acetonyl group, a pyridyl group or a furyl group; X represents a hydrogen, Na, K or NH4, and n represents an integer of 0-4.)
申请公布号 KR20060016767(A) 申请公布日期 2006.02.22
申请号 KR20057020800 申请日期 2005.11.02
申请人 NIKKO MATERIALS COMPANY, LIMITED 发明人 HINO EIJI;KUMAGAI MASASHI
分类号 C23C18/44 主分类号 C23C18/44
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