METHOD OF USING PRE-APPLIED UNDERFILL ENCAPSULANT

摘要

The invention describes a method of preparing one or more surface mount components containing one or more solder bumps having an exposed tip on at least one side, comprising the steps of:
a) providing an underfil encapsulant at a temperature higher than the melt temperature of the underfill encapsulant;.
b) contacting the component with the underfill encapsulant such that a coating of underfill encapsulant is formed on at least one of the solder bumps; and
c) cooling the underfill encapsulant to a temperature such that the coating solidifies to a tacky consistency.