发明名称 |
AN INTEGRATED CIRCUIT PACKAGE EMPLOYING A FLEXIBLE SUBSTRATE |
摘要 |
An integrated circuit package includes a flexible laminar substrate 1. The substrate 1 has a flexible layer 5 of heat conductive material on one of its faces. The layer 5 extends across an aperture 9 in the flexible substrate 1. A first integrated circuit 11 is mounted on the layer 5 within the aperture 9, and wire bonded to the substrate 1. A flip chip 21 is mounted on the first integrated circuit 11. The two integrated circuits 11, 21 are embedded in a resin body 23. |
申请公布号 |
EP1627430(A1) |
申请公布日期 |
2006.02.22 |
申请号 |
EP20030736426 |
申请日期 |
2003.05.28 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
FERNANDEZ, ELSTAN ANTHONY |
分类号 |
H01L23/31;H01L23/36;H01L25/065 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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