| 摘要 |
In order to eliminate film thickness nonuniformity of filters and to attain a cost reduction by simultaneously performing planarizing processes of a scribe region and a photoelectric conversion portion, in a color solid-state image pickup device which is separated into a plurality of color solid-state image pickup chips each of which consists of a photoelectric conversion portion and a peripheral circuit portion thereof formed on a semiconductor substrate, a portion of a scribe region for separating the structure on the semiconductor substrate into the color solid-state image pickup chips has a layer structure having the same layers as the photoelectric conversion portion. This invention is also applied to a chip array type color solid-state image pickup device which is constituted by arranging, on a semiconductor substrate, a plurality of color solid-state image pickup chips, each having an array of a plurality of photoelectric conversion portions. <IMAGE> |
