| 摘要 |
<p>PROBLEM TO BE SOLVED: To maintain a firm and long-termed and stable connection state of a wiring substrate provided with a metallized wiring layer on a surface of or inside an insulation substrate having high thermal expansion characteristics, or a semiconductor element accommodating package having high thermal expansion characteristics and accommodating semiconductor elements, to an external electric circuit using glass-epoxy resin, etc., as an insulation body. SOLUTION: In a wiring substrate provided with an insulation substrate 1 and a metallized wiring layer 3, the insulation substrate 1 is composed of a sintered body having a thermal expansion coefficient 8 to 18 ppm/ deg.C at 40 to 400 deg.C which is obtained by sintering a forming body containing lithium silicate glass of 20 to 80 volume % containing Li2 O of 2 to 15 wt.% and CaO of 2 to 30 wt.% and a filler of 80 to 20 volume % containing a metal oxide having a thermal expansion coefficient 6 ppm/ deg.C or more at 40 to 400 deg.C.</p> |
