发明名称 SOLDERING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a soldering method of high quality. SOLUTION: A vacuum chamber in which a work having solid state solder containing tin alone or tin and one or more components selected from silver, lead, copper, bismuth, indium and zinc is arranged is evacuated into a vacuum state. Thus, a free radical gas is generated to remove an oxide film in the solder. Thereafter, the generation of the free radical gas is stopped, and the solder is heated to a temperature equal to or higher than the melting point of the solder in a nonoxidizing atmosphere to melt the solder. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005230830(A) 申请公布日期 2005.09.02
申请号 JP20040040237 申请日期 2004.02.17
申请人 SHINKO SEIKI CO LTD 发明人 ONO TAKAHIDE;NAKAMORI TAKASHI;SUENAGA MAKOTO;TAKEUCHI TATSUYA;KAGAMI JOJI;HAGIWARA TAIZO
分类号 B23K1/20;B23K1/008;B23K3/08;B23K31/02;B23K35/26;C22C13/00;H05K3/34;(IPC1-7):B23K1/20 主分类号 B23K1/20
代理机构 代理人
主权项
地址