| 摘要 |
PROBLEM TO BE SOLVED: To provide a table for a wafer polishing device which is excellent in adhesiveness of a polishing pad to a pad holding surface, and is suitable for manufacture of a wafer having a large diameter and high quality. SOLUTION: This table 2 for wafer polishing device comprises a table body comprised of ceramic base members 11A and 11B, and a polishing pad 18 which is adhered to be detacable via an adhesive 17 to a pad adhesion surface 2a of the table body. A semiconductor wafer 5 is brought into sliding contact with the polishing pad 18, whereby the semiconductor wafer 5 is polished. A surface roughness of the pad adhesion surface 2a is 0.15 μm to 0.3 μm. |
