| 摘要 |
<p>Provided is a two-part curable silicone composition including: (A) 100 parts by mass of an organopolysiloxane containing at least two alkenyl groups bonded to silicon atoms, (B) an organohydrogenpolysiloxane containing at least two SiH groups, in sufficient quantity to provide from 0.5 to 5.0 mols of SiH groups within the component (B) for every 1 mol of alkenyl groups within the entire composition, (C) an effective quantity of a hydrosilylation reaction catalyst, and (D) from 0.0001 to 1 part by mass of a nitrogen-containing compound (a triazole-based compound and/or an imidazole-based compound),
which is prepared in two separate parts, in which
the components (A) through (C) do not exist within one part, and
the component (D) exists in a different part from that of the component (C). Also provided are a method of curing the composition and a cured product obtained by the method. Further provided are a method for potting an electrical and electronic component using the composition and a method for producing a silicone rubber molded product using the composition. The composition is capable of stably maintaining favorable curability and a high level of flame retardancy or a low compression set, and is useful for silicone rubber potting materials and silicone rubber molded products.</p> |
