| 摘要 |
A method of making a fluid cooled microelectronic package (10'/60') in which fluid is circulated through the package in fluid-carrying channels (40/64) defined at least in part by voids in an encapsulant (38) that surrounds the package components (12, 14, 16). Preferably, the encapsulant channels (40/64) are defined in part by heat producing components (12, 14, 16) of the package so that coolant fluid directly contacts such components. The coolant fluid can be electrically conductive or non-conductive depending on the type of components being cooled. The coolant channels (40) are formed by insert-molding a form (24) in the encapsulant (38), and removing the form (24) following the molding process. Alternately, the encapsulant is formed in two or more pieces (38a, 38b) that are joined to form the package (60'), and the coolant channels (64) are defined by recesses (62) formed in at least one of the encapsulant pieces (38a, 38b). |
