Liquid crystal display driver integrated circuit package

摘要

Disclosed is an LCD driver integrated circuit package and a chip on glass type LCD device using the package. The LCD driver integrated circuit package includes a mold that has signal output bumps and signal input bumps formed thereon, wherein the signal output bumps and the signal input bumps have different surface areas that contact the mold and an adjacent conductive film. Due to the different contact surface areas, different amounts of pressure are applied to different parts on the conductive film when a force is applied to the mold. One or more bump pressure control patterns are formed on the mold compensate for the difference in pressure caused by this difference between the total contact areas. Accordingly, the LCD driver integrated circuit package can be mounted on a chip on glass type LCD panel without causing device failure.