发明名称 Method of manufacturing semiconductor device having first and second insulating films
摘要 In order to increase an aperture ratio, a part of or all of a gate electrode that overlaps with channel formation regions ( 213, 214 ) of a pixel TFT is caused to overlap with second wirings (source line or drain line) ( 154, 157 ). Additionally, a first interlayer insulating film ( 149 ) and a second interlayer insulating film ( 150 c) are disposed between the gate electrode and the second wirings ( 154, 157 ) so as to decrease a parasitic capacitance.
申请公布号 US7001801(B2) 申请公布日期 2006.02.21
申请号 US20030413736 申请日期 2003.04.15
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 YAMAZAKI SHUNPEI;SUZAWA HIDEOMI;YAMAGATA HIROKAZU
分类号 H01L21/00;G02F1/1362;H01L21/336;H01L21/77;H01L21/84;H01L27/12;H01L27/32 主分类号 H01L21/00
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