发明名称 |
Method of manufacturing semiconductor device having first and second insulating films |
摘要 |
In order to increase an aperture ratio, a part of or all of a gate electrode that overlaps with channel formation regions ( 213, 214 ) of a pixel TFT is caused to overlap with second wirings (source line or drain line) ( 154, 157 ). Additionally, a first interlayer insulating film ( 149 ) and a second interlayer insulating film ( 150 c) are disposed between the gate electrode and the second wirings ( 154, 157 ) so as to decrease a parasitic capacitance.
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申请公布号 |
US7001801(B2) |
申请公布日期 |
2006.02.21 |
申请号 |
US20030413736 |
申请日期 |
2003.04.15 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
YAMAZAKI SHUNPEI;SUZAWA HIDEOMI;YAMAGATA HIROKAZU |
分类号 |
H01L21/00;G02F1/1362;H01L21/336;H01L21/77;H01L21/84;H01L27/12;H01L27/32 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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