发明名称 |
Electroplating apparatus and four mask TFT array process with electroplated metal |
摘要 |
An electroplating apparatus, in accordance with the present invention, includes a plurality of chambers. A first chamber includes an anode therein. The first chamber has an opening for delivering an electrolytic solution containing metal ions onto a surface to be electroplated. The surface to be electroplated is preferably a cathode. A second chamber is formed adjacent to the first chamber and has a second opening in proximity of the first opening for removing electrolytic solution containing metal ions from the surface to be electroplated. The plurality of chambers are adapted for movement in a first direction along the surface to be electroplated.
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申请公布号 |
US7001498(B2) |
申请公布日期 |
2006.02.21 |
申请号 |
US20020268633 |
申请日期 |
2002.10.10 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COLGAN EVAN GEORGE;FLAKE JOHN CHRISTOPHER;ROMANKIW LUBOMYR TARAS;WISNIEFF ROBERT LUKE |
分类号 |
C25D5/04;C25D7/12;C25D17/00;H01L21/77;H01L21/84 |
主分类号 |
C25D5/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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