发明名称 Low noise heatsink
摘要 A thermal management device includes a thermally conductive core, a thermally conductive frame positioned around the core, the frame defining at least one opening, and at least one thermally conductive insert disposed in the opening in the frame.
申请公布号 US7002795(B2) 申请公布日期 2006.02.21
申请号 US20030609103 申请日期 2003.06.26
申请人 INTEL CORPORATION 发明人 TRAUTMAN MARK A.;DASKALAKIS GEORGE
分类号 H05K7/20;H01L23/367;H01L23/467 主分类号 H05K7/20
代理机构 代理人
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