RESIN COMPOSITION FOR THERMALLY CONDUCTIVE MATERIAL AND THERMALLY CONDUCTIVE MATERIAL

摘要

A resin composition for thermally conductive materials which comprises a polymer (I), a liquid plasticizer (II), and a thermally conductive filler (III) having a thermal conductivity of 20 W/m.K or higher, characterized in that the liquid plasticizer (II) is liquid at 25°C and has a percentage loss of weight through 24-hour holding at 130°C of 2 wt. % or smaller. A thermally conductive material excellent in thermal conductivity and flexibility could be obtained from the resin composition for thermally conductive materials.