| 摘要 |
<p>A semiconductor device wherein a force of peeling a chip from a substrate does not operate even the semiconductor device is exposed under a high temperature condition after bonding and a bonding state of the substrate and the chip can be maintained, and a method for manufacturing such semiconductor device are provided. Specifically, in the semiconductor manufacture, a recessed alignment mark (8) is formed on a front plane of a high distortion point glass substrate (1) as a target for alignment for bonding, and the recessed alignment mark (8) is permitted to have a shape which extends to an external side of the semiconductor device (20). Thus, excellent bonding between the high distortion point glass substrate (1) and the semiconductor device (20) can be provided, and at the same time, since the recessed alignment mark (8) is not sealed, the bonding state can be maintained even when the high distortion point glass substrate (1) is exposed under the high temperature condition after bonding the semiconductor device (20).</p> |
