发明名称 POSITIVE TYPE RESIST COMPOSITION FOR USE IN LIQUID IMMERSION EXPOSURE AND PATTERN FORMING METHOD USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive type resist composition in which a defect, a scum and an elution ratio when liquid immersion exposure are improved and favorable for a liquid immersion exposure, and to provide a pattern forming method using the same. <P>SOLUTION: The positive type resist composition for use in liquid immersion exposure includes (A) a resin which has a monocyclic or polycyclic alicyclic hydrocarbon structure and in which solubility for an alkali developer increases by an action of acid, (B) a compound which generates acid upon irradiation with an active light or a radiation, (C) an alkali soluble compound which has an alkyl group of 5 or more carbon atoms and (D) a solvent. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006048029(A) 申请公布日期 2006.02.16
申请号 JP20050196529 申请日期 2005.07.05
申请人 FUJI PHOTO FILM CO LTD 发明人 KANDA HIROMI;INABE HARUKI
分类号 G03F7/039;G03F7/004;H01L21/027 主分类号 G03F7/039
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