| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily mount an IC tag on an object in proper attributes. <P>SOLUTION: A positioning layer 7 constituted of adhesive is flatly formed on the flat surface of an object 6 constituted of synthetic resin, and an IC tag 1 constituted of an IC chip 2 and an antenna 3 is mounted on the surface of the positioning layer 7 in a status that an adhesive force is developed by the non-hardening of the adhesive, and a connection layer 8 constituted of flat adhesive is formed on the surface of the positioning layer 7 on which the IC tag is mounted and the flat surface of the object 6, and a plate-shaped coating 9 constituted of synthetic resin is mounted on the surface of the connection layer 8 in a status that the adhesive force is developed by the non-hardening of the adhesive, and a structure constituted of the object 6 and the positioning layer 7 and the IC tag 1 and the connection layer 8 and the coating 9 is heated and pressurized by a supporting body 10 and a pressurizing body 12 so that the object 6 and the coating 9 can be connected to each other with the connection layer 8, and that the IC tag 1 can be buried between the object 6 and the coating 9. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
