| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for optimizing the control and supply of a fluid to a wafer and processing a substrate reducing the deposition of contamination on the surface of the wafer. SOLUTION: The apparatus has a proximity head proximate to the surface of a substrate in operation. Moreover, the apparatus has an opening communicating with a cavity formed in the proximity head in the surface of the proximity head. The cavity feeds an activator to the surface of the substrate through the opening. The apparatus, moreover, has a plurality of conduits constituted to form a fluid meniscus surrounding the opening on the surface of the substrate on the surface of the proximity head. COPYRIGHT: (C)2006,JPO&NCIPI
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