发明名称 Process for making stacks of islands made of one semiconducting material encapsulated in another semiconducting material
摘要 The invention relates to the product ion of a stacked structure of planes of islands of a first semiconducting material encapsulated in a second semiconducting material on a substrate, comprising alternate deposition of planes of islands of a first semiconducting material and encapsulation layers of a second semiconducting material, the planes of islands of the first semiconducting material being made at an optimum growth temperature and at an optimum precursor gas partial pressure to result in a stacked structure for which the optical properties enable production of optoelectronic components to optically interconnect integrated circuits. The stacked structure is made on a plane of islands of a third semiconducting material called the sacrificial plane encapsulated in a fourth semiconducting material, the islands of the sacrificial plane being made under growth conditions that can result in high densities of small islands, in other words at a temperature below the optimum growth temperature and/or at a precursor gas partial pressure greater than the optimum partial pressure.
申请公布号 US2006035399(A1) 申请公布日期 2006.02.16
申请号 US20050202316 申请日期 2005.08.12
申请人 COMMISSARIAT A L'ENERGIE ATOMIQUE 发明人 DAMLENCOURT JEAN-FRANCOIS;VANDELLE BENOIT
分类号 H01L21/20;H01L29/12 主分类号 H01L21/20
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