发明名称 |
Methods for forming an undercut region and electronic devices incorporating the same |
摘要 |
An electronic device having a substrate structure having an undercut region is provided and further included is a method for forming an undercut region of a substrate structure. The method includes forming a patterned protective layer over a first electrode. The method also includes forming the substrate structure over the patterned protective layer. An opening within the substrate structure overlies an exposed portion of the substrate structure. The method further includes removing the exposed portion of the patterned protective layer, thereby exposing a portion of the first electrode and forming an undercut region of the substrate structure. The method still further includes depositing a liquid over the first electrode after removing the exposed portion of the patterned protective layer, and solidifying the liquid to form a solid layer.
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申请公布号 |
US2006035469(A1) |
申请公布日期 |
2006.02.16 |
申请号 |
US20040915578 |
申请日期 |
2004.08.10 |
申请人 |
TRUONG NUGENT;MACPHERSON CHARLES D |
发明人 |
TRUONG NUGENT;MACPHERSON CHARLES D. |
分类号 |
H01L21/302 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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