发明名称 Nitride semiconductor light emitting diode and method of manufacturing the same
摘要 The present invention provides a flip chip-type nitride semiconductor light emitting diode. The nitride semiconductor light emitting diode comprises a light transmittance substrate, an n-type nitride semiconductor layer, an active layer, a p-type nitride semiconductor layer and a mesh-type DBR reflecting layer. The mesh-type DBR reflecting layer has a plurality of open regions. The mesh-type DBR reflecting layer is composed of first and second nitride layers having different Al content. The first and second nitride layers are alternately stacked several times to form the mesh-type DBR reflecting layer. An ohmic contact layer is formed on the mesh-type DBR reflecting layer and on the p-type nitride semiconductor layer.
申请公布号 US2006033113(A1) 申请公布日期 2006.02.16
申请号 US20050064968 申请日期 2005.02.25
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE JAE H.;KIM IN E.;KIM YONG C.;KIM HYUN K.;KONG MOON H.
分类号 H01L33/10;H01L33/32;H01L33/62 主分类号 H01L33/10
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