| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a part built-in substrate securing the heat dissipation property and reliability of a built-in part, and also to provide a manufacturing method of the same. <P>SOLUTION: In a process of manufacturing a part built-in substrate, a semiconductor part 1 is fixed to a metal plate 8a with an adhesive 9, further, interlayer insulating layers 4-1 to 4-3 and wiring layers 6-1 to 6-3 are sequentially laminated on the metal plate 8a and the semiconductor part 1 to form other wiring layers 8 with the metal plate 8a. In the manufacturing of the part built-in substrate, the use of the metal plate 8a allows the flatness of the semiconductor part 1 laminated on the metal plate 8a, the interlayer insulating layers 4-1 to 4-3 and the wiring layers 6-1 to 6-3 to be improved, thereby enabling the system to suppress any defects of the in-process part built-in substrate 1 accompanied with a warp of the substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
