| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a fluid-pressure regulated wafer polishing head which secures a uniformity in polishing of a wafer. <P>SOLUTION: A recess 126 is formed at and a sealing mechanism is provided at a wafer backing member 124, wherein the recess is formed between the wafer 142 and the member, in which the recess is extended near to an outer edge of the backing member 124 from the backing member, and the sealing mechanism holds fluid or gas at the recess 126 in the rear of the wafer and applies uniform pressure to an entire surface of the wafer which is pushed onto a polishing pad 182. An airtight bellows chamber 120 applies a primary load which supports the wafer backing member 124 to push it onto the polishing pad 182, and pushes the wafer 142 onto the pad 182. When the wafer 142 is pushed onto the polishing pad 182 by pressurizing a bellows 118, a seal 130 is compressed. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
