| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is so structured as to fix the back face of a semiconductor chip to a heat spreader via a resin and yet allow the semiconductor back face to come in direct contact with the heat spreader to offer a fine heat dessipating effect. SOLUTION: The semiconductor chip 1 with its front face down is mounted on a mounting board 2 by a flip-chip method. The heat spreader 8 is fixed to the back face of the semiconductor chip 1 via the resin adhesive 9, where the back face of the semiconductor chip 1 is allowed to come in direct contact with the heat spreader 8. COPYRIGHT: (C)2006,JPO&NCIPI
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