发明名称 FILM FORMATION MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a high quality insulating film that has a lower permittivity than conventional SiO<SB>2</SB>and perfectly prevents leak current exceeding 10<SP>-8</SP>A/cm<SP>2</SP>when 20 V is applied. SOLUTION: This film is a material for forming films through chemical crystal growth from vapor. It comprises one or multiple kinds of chemical compounds to be selected from groups belonging to the following group [I] and one or multiple kinds of chemical compounds to be selected among groups belonging to the following group [II]. Where, [I] contains HSi(OCH<SB>3</SB>)<SB>3</SB>, H<SB>2</SB>Si(OCH<SB>3</SB>)<SB>2</SB>and HSi(CH<SB>3</SB>)(OCH<SB>3</SB>)<SB>2</SB>while [II] contains (CH<SB>2</SB>=CH)Si(OCH<SB>3</SB>)<SB>3</SB>, (CH<SB>2</SB>=CH)Si(OC<SB>2</SB>H<SB>5</SB>)<SB>3</SB>, (CH<SB>2</SB>=CH)Si(CH<SB>3</SB>)(OCH<SB>3</SB>)<SB>2</SB>, (CH<SB>2</SB>=CH)Si(CH<SB>3</SB>)(OC<SB>2</SB>H<SB>5</SB>)<SB>2</SB>, (CH<SB>2</SB>=CH)Si(CH<SB>3</SB>)<SB>2</SB>(OCH<SB>3</SB>) and (CH<SB>2</SB>=CH)Si(CH<SB>3</SB>)<SB>2</SB>(OC<SB>2</SB>H<SB>5</SB>). COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006049603(A) 申请公布日期 2006.02.16
申请号 JP20040229019 申请日期 2004.08.05
申请人 TRI CHEMICAL LABORATORY INC 发明人 MACHIDA HIDEAKI;KADA TAKESHI;ISHIKAWA MASATO;NODA NAOTO
分类号 H01L21/316;H01L21/768;H01L23/522 主分类号 H01L21/316
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